US to Invest $ 1.6 Billion in Advanced Packaging Research

The US Department of Commerce announced it will open competition for funding to conduct research in semiconductor advanced packaging. The R&D activities will be held under the CHIPS program, and will aim to establish and accelerate domestic capacity. According to the Department’s Notice of Funding Opportunity (NOFO), the budget should reach around $1.6 billion. Each […]

South Korea, Samsung to Lead 6G Standardisation Group at ITU

Samsung Research’s HyoungJin Choi has been re-conducted as the chair of the IMT-2030 Coordination Group at the ITU. He will serve in the position until 2029, when commercial 6G is expected to be on its way. The researcher served as the Chairman of the 6G Vision Group at the ITU Radiocommunication Sector (ITU-R) from 2021 […]